Solder Tin Paste Mechanic Xg60 138C
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SOLDERING PASTE MECHANIC XG60 138C
Advanced insulation technology...High viscosity no-clean flux, can be used for PCB, SMD rework, as well as computer and phone chip reballing.
Mixture of high-quality alloy powder and pasty resin flux, which prevents pale yellow residue, making it easy to clean the board.
Super compact: Solder paste for mobile phone PCB, SMD, PGA and computer among others.
-Helps repair circuit boards and protects electronic components
- Flux Solder Paste - No need to clean solder
-Solder paste syringe is an ideal assistant for phone motherboard and repair mobile phone surface mount assemblies.
-The syringe plunger will provide premium activity levels with maximum wetting and extension, the 10cc syringe is available for all rework soldering and desoldering repairs.
*High quality, perfect performance, easy to weld.
*Suitable for mobile phone repair industry, digital computer service industry, high-precision circuit smd welding, BGA welding technology, etc.
